MediaTek Dimensity 8200 brings life to affordable smartphones

MediaTek's Dimensity 8200 has been unveiled and new chipset brings intense upgrades for the cheaper smartphones. Arriving for sub-flagship smartphones, features high performance for excellent gaming experience with its advanced features. Let's check all the details about new chipset.

MediaTek Dimensity 8200 is now official, here are specifications and more 

By produced within TSMC's 4nm process, MediaTek's most recent Dimensity 8200 SoC enters the sub-flagship market. The powerful A16 Bionic that powers the iPhone 14 Pro was also manufactured by Apple using the same 4nm process. The MediaTek 8100 uses TSMC's 5nm process as a comparison.

The other major change is in the core architecture. The Dimensity 8100 featured a dual-cluster design with four Cortex-A78 cores and four of Cortex-A55 cores. The Dimensity 8200 adopts the flagship Dimensity 9200 SoC and a three-cluster design in flagship SoCs. The Dimensity 8200 runs on "one" Cortex-A78 core at 3.1 GHz, three more at 3.0 GHz for performance, and four Cortex-A55 at 2.0 GHz for the efficiency aim.

Moreover, for advanced and smooth gaming experience, Dimensity 8200 offers HyperEngine 6.0, supporting Vulkan SDK for raytracing in gaming, FPS improvement and resource optimizations. In terms of connectivity, the new chip inherited the dual-5G connectivity, Wi-Fi 6E, Bluetooth 5.3, and downlink speed from its predecessors.