Huawei P70 will feature that eagerly anticipated feature
A very significant feature of the P70 model, developed by Chinese tech giant Huawei, has been revealed.
In the smartphone industry, rising from setbacks is an extraordinary feat, a narrative vividly demonstrated by Huawei through its formidable return with the Mate 60 series. This resiliency is impressively attributed to the incorporation of its homegrown Kirin 9000S chipset, flaunting 5G capabilities, and reflecting a strategic pivot towards diminishing dependency on U.S. chip suppliers. Yet, as the firm basks in its resurgence, forthcoming U.S. policy alterations, potentially imposing stringent export controls on pivotal chipmaking equipment and AI chips, loom as probable impediments to Huawei's burgeoning prospects.
Huawei’s Mate 60 series, despite traversing through a series of obstacles, is witnessing robust sales, strengthening its foothold in the competitive smartphone domain. An unintended consequence of this elevated demand is the ascension in the prices of vital components, notably, the under-screen optical fingerprint modules integral to the Mate 60 devices, experiencing a 15-30% surge. Notably, Goodix, GigaDevice (Siliwei), and Weier Technology (Jihao Technology) are identified as the principal suppliers of these chips for the Mate 60 series.
Huawei P70 will feature that eagerly anticipated feature
As the gaze shifts toward the future, the upcoming Huawei P70, scheduled for a 2024 release, is anticipated to inherit the under-screen optical fingerprint technology from the Mate 60 series, per sources within the supply chain. Moreover, the Kirin 9000S chipset, already acclaimed in previous discussions, is touted to be a key feature.
With an ambitious aim to double its smartphone exports in 2024, targeting a formidable 60 to 70 million units, Huawei is channeling its focus towards procuring optical fingerprint modules, which have witnessed price augmentations driven by soaring demand. The company is seemingly proactively amassing inventory to ensure a seamless launch and distribution trajectory for the P70 flagship.
Despite facing recent challenges, characterized by persistently high-volume orders from partners which have pressurized the availability of essential components and perturbed production rhythms, Huawei remains staunchly committed to its ambitious shipping target of 60-70 million smartphones in the approaching year. The P70 is poised to be a linchpin in realizing this strategy. Furthermore, from 2024 onwards, the company plans to sever ties with Qualcomm, opting to exclusively integrate its in-house Kirin processors in new models.