MediaTek Dimensity 9300 aims to be the biggest rival of Snapdragon 8 Gen 3
While the relentless competition between MediaTek and Qualcomm continues at full speed, all eyes are on the new flagship chipset models of both companies.
The forthcoming MediaTek Dimensity 9300 is showing promise as a significant contender in the mobile chipset arena. Reports indicate that the chip's four X4 super-large cores, based on the Armv9 architecture, have the potential to surpass the performance of both the Snapdragon 8 Gen 3 and the Apple A17 Bionic. MediaTek reportedly has a provisional plan to set the frequency of these cores at 3Ghz, and is awaiting the final landing frequency of Qualcomm’s Snapdragon 8 Gen 3 to finalize its own settings.
The Dimensity 9300, a top-tier chipset scheduled for a late 2023 release, is expected to boast a 4+4+1 octa-core CPU architecture. It is designed with four X4 super-large cores, founded on the Armv9 architecture, and set to clock at a base of 3.0GHz. Four A720 large cores, also built on the Armv9 architecture and clocked at 2.0GHz, are included. The final frequency is still subject to change, with MediaTek reportedly waiting for the landing frequency of Snapdragon 8 Gen 3 to lock in its settings, according to the Digital Chat Station on Weibo.
MediaTek Dimensity 9300 aims to be the biggest rival of Snapdragon 8 Gen 3
Qualcomm's 2023 Snapdragon Summit, scheduled for October 24 to 26, is where we anticipate the new Snapdragon 8 Gen 3 chip will be unveiled. This chipset may feature a higher clock speed than that of the Dimensity 9300. Therefore, MediaTek can ensure its performance is on par with Qualcomm’s upcoming flagship chip by adjusting the clock speed of the Dimensity 9300’s CPU cores accordingly.
The Dimensity 9300 is expected to be built on TSMC's N4P process, a 4 nm process node that offers superior performance and significant power efficiency improvements over the N5 and N4 processes. It has also been confirmed that the MediaTek Dimensity 9300 will incorporate the Immortalis-G720 GPU.